By Dick Otte, Promex
[Image courtesy of Promex Industries]
The electronics industry began using the term heterogeneous integration (HI) about five years ago to describe a new approach to building semiconductor devices that would allow for greater density and capability. The legacy approach to making transistors, lines, and spaces smaller was becoming more difficult due to the limitations of lithography. Thus, a new idea was spawned: adding material and/or parts to die on conventional complementary metal-oxide semiconductor (CMOS) wafers to add functionality beyond what is inherent in silicon CMOS.John Bowers at the University of California Santa Barbara pioneered an early HI example, placing a small piece of indium phosphide onto a waveguide fabricated on a silicon wafer. Doing so made it possible …